According to Bloomberg News, in order to ensure the supply of key components, the German government plans to allocate 20 billion euros to support the semiconductor manufacturing industry, hoping to support the country's technology industry as global geopolitical tensions intensify. The money will be allocated to German and international companies until 2027 and will be drawn from the Climate and Transformation Fund, the report quoted people familiar with the matter as saying. Looking specifically at the allocation of 20 billion euros, the German government has agreed to provide Intel's German factory with a subsidy of 10 billion euros, which is equivalent to one-third of the total investment in the new factory, and will provide TSMC with about 5 billion euros in subsidies for the construction of the new factory , which is equivalent to half of the total investment in the factory. As for Infineon, it is expected to receive a subsidy of 1 billion euros, accounting for about 20% of the total investment in the new factory. As for the remaining 5 billion euros, it is estimated that Infineon and Bosch may be potential beneficiaries. Reposted from: International Electronic Commerce, automatically translated by Google

Huai Jinpeng pointed out that the Ministry of Education will cultivate a number of major scientific and technological projects centering on strategic, basic and leading industries such as integrated circuits, industrial motherboards, instruments and meters, and biomedicine, and concentrate efforts on scientific research. Huai Jinpeng said that in response to national urgent needs and major national strategies, we will promote cooperation with relevant national departments to further solve the problem of "stuck neck" in core technologies. At present, integrated circuits, as the foundation and core of the modern information technology industry, are widely used in various electronic products. They are an indispensable part of the information age and have become a strategic, basic, and leading industry for national economic and social development. Although with policy support and market development, China's integrated circuit industry has accumulated a certain industrial foundation and advantages, but some "stuck neck" technologies are still subject to others. The fundamental reason is that the problem of talents has become one of the key factors restricting the development of my country's semiconductor industry. In order to alleviate the shortage of talents in my country's integrated circuit industry, the exemplary microelectronics college has become an important mechanism for the cultivation of integrated circuit talents in my country. The data shows that from 2015 to 2018, the number of students enrolled in the national "26+1" demonstration microelectronics colleges has risen steadily, and stable output can basically be achieved. However, for now, there is still room for optimization of high-level and innovative high-level talents in the semiconductor field in my country. To this end, in recent years, many well-known colleges and universities in my country have successively established integrated circuit colleges to train high-quality and sophisticated talents in the semiconductor industry, including Peking University, Tsinghua University, Huazhong University of Science and Technology, Sun Yat-sen University, Nanjing University of Posts and Telecommunications, Guangdong Industrial University, etc. At present, all major universities and enterprises are strengthening cooperation with each other. For example, Guangdong University of Technology has successively established joint innovation laboratories with Huawei, Allwinner Technology, Cansemi Semiconductor, and five electronics institutes of the Ministry of Industry and Information Technology; University of Science and Technology of China and Hefei University of Technology Sign a joint training agreement to jointly cultivate high-level chip talents. It is worth mentioning that, in response to the urgent needs of the country and the "stuck neck" of major national strategic core technologies, the Ministry of Education proposed to overcome a number of key core technologies urgently needed by the national strategy in the key core technology fields, and effectively improve the industrial chain, supply chain resilience and Competitiveness, a group of high-level research universities have become talent centers and innovation highlands with world influence, and become the core force supporting a strong education, science and technology, and talent power. Reposted from: International Electronic Commerce, automatically translated by Google

Five departments, including the Ministry of Industry and Information Technology, the Ministry of Education, the Ministry of Science and Technology, the Ministry of Finance, and the State Administration for Market Regulation, recently jointly issued the "Implementation Opinions on Improving the Reliability of the Manufacturing Industry", proposing to focus on the strategic goals of manufacturing a strong country and a strong quality country, focusing on machinery and electronics. , automobiles and other key industries, benchmark the advanced level of similar international products, make up for the shortcomings of basic product reliability, improve the reliability level of complete machine equipment, strengthen the reliability professional talent team, and form a group of products with high reliability and strong market competitiveness , A manufacturing enterprise with a strong brand influence. By 2025, the reliability level of key core products in key industries will be significantly improved, the reliability standard system will be basically established, the quality and reliability management capabilities of enterprises will be continuously enhanced, the reliability test verification capabilities will be greatly improved, and the professional talent team will continue to grow. Build 3 or more reliability common technology research and development service platforms, form more than 100 typical demonstrations of reliability improvement, and promote more than 1,000 enterprises to implement reliability improvement. By 2030, the reliability level of 10 key core products will reach the international advanced level, the leading role of reliability standards will be fully demonstrated, a group of reliability public service institutions and reliability professionals will be cultivated, and the overall reliability level of my country's manufacturing industry will reach a new level , has become an important engine supporting the high-quality development of the manufacturing industry. Specifically, in the electronics industry, the basic product level will focus on improving high-end general-purpose chips such as SoC/MCU/GPU for electronic equipment, wide-bandgap semiconductor power devices such as gallium nitride/silicon carbide, precision optical components, and optical communications. The reliability level of electronic components such as devices, new sensitive components and sensors, highly adaptable sensor modules, Beidou chips and devices, chip RC components, high-speed connectors, high-end radio frequency devices, high-end electromechanical components, and LED chips . Improve high-frequency high-speed printed circuit boards and substrates, new display materials, high-efficiency photovoltaic battery materials, key materials for lithium batteries, electronic pastes, electronic resins, electronic chemicals, new display electronic functional materials, advanced ceramic substrate materials, electronic assembly Improve the performance of electronic materials such as advanced packaging materials for materials and chips, improve the technical level of component packaging and curing, uniform epitaxy, and defect control, and strengthen material analysis, destructive physical analysis, reliability test analysis, board-level reliability analysis, failure analysis, etc. Analyze and evaluate technology research and development and standard system construction, and promote application in related industries. The overall equipment and system level will focus on improving smart products such as drones, virtual reality/augmented reality (VR/AR) equipment, service robots, and smart door locks, and electronics such as exposure machines, evaporation machines, slicers, and coating machines. Special equipment, mass spectrometers, oscilloscopes, electronic lenses and other electronic measuring instruments, high-efficiency photovoltaic cells and other products, Beidou navigation terminals, 5G communication equipment and other Internet of Things terminals, high-end servers, laser printers, remote conference systems and other computers and external equipment reliability level . Reposted from: International Electronic Commerce, automatically translated by Google

International Electronics Business News on the 15th According to a report released earlier this week by the International Semiconductor Industry Association (SEMI), global spending on 300mm (12-inch) fab equipment for front-end facilities is expected to decline next year, following a decline in 2023. It will start to grow continuously and is expected to reach a record high of US$118.8 billion by 2026. SEMI expects global 300mm fab equipment spending to drop 18% to $74 billion in 2023, grow 12% to $82 billion in 2024, grow 24% to $101.9 billion in 2025, and grow 17% to $101.9 billion in 2026. $118.8 billion. Strong demand for high-performance computing, automotive applications, and increased demand for memory will drive double-digit percentage growth in equipment spending over the three-year period, the association said. SEMI President and CEO Ajit Manocha said the forecasted wave of growth in equipment spending highlights strong long-term demand for semiconductors, with the foundry and memory industries set to feature prominently in this expansion, indicating demand for chips across a broad range of end markets and applications . In terms of regions, SEMI expects South Korea to lead global 300mm fab equipment spending with an investment of $30.2 billion in 2026, nearly doubling from $15.7 billion in 2023. Taiwan is expected to spend $23.8 billion in 2026, up from $22.4 billion this year, while mainland China is expected to spend $16.1 billion in 2026, up from $14.9 billion in 2023. U.S. equipment spending is expected to nearly double from $9.6 billion this year to $18.8 billion in 2026. From a market segment perspective, the foundry industry is expected to lead other areas in equipment spending in 2026, reaching $62.1 billion, up from $44.6 billion in 2023; followed by memory at $42.9 billion, up from 2023 170%; analog spending is expected to grow from $500 million to $6.2 billion in 2026; spending in microprocessors/microcontrollers, discretes (mainly power devices) and optoelectronics is expected to decline in 2026, while logic Investment is expected to rise. Reposted from: International Electronic Commerce, automatically translated by Google

Recently, the US Semiconductor Industry Association (SIA) launched a new map of the US semiconductor ecosystem on its official website. According to this tool, users can query nearly 500 sites related to the upstream and downstream industry chain of semiconductors in 42 states in various regions of the United States. These sites involve semiconductor manufacturing, chip design, intellectual property and chip design software suppliers, semiconductor materials and manufacturing equipment manufacturers and universities and research institutes. the Of particular note is the U.S. Semiconductor Ecosystem Map, which highlights announced corporate investments in new and expanded semiconductor ecosystem projects. These projects cover a range of activities required to support the U.S. chip ecosystem, including new, expanded or upgraded factories, semiconductor equipment facilities, and production facilities in various semiconductor fields (such as advanced logic, memory, analog and traditional chips). key materials used. According to the SIA disclosure, from the promulgation of the "Chip Act" in the spring of 2020 to the months after its promulgation in August 2022, companies in the US semiconductor ecosystem announced dozens of projects. Some highlights of announcements driven by the CHIPS Act through March 2023 include: Nineteen states announced more than $210 billion in new private investment to increase manufacturing capacity in the U.S.; more than 50 new semiconductor ecosystem projects announced across the U.S., including building new fabs, expanding existing factories, and providing chip manufacturing facilities for materials and equipment used, 44,000 new high-quality jobs announced in the semiconductor ecosystem as part of new projects; Reposted from: International Electronic Commerce, automatically translated by Google

China's information technology development faces three opportunities and four challenges On April 7, the 11th China Electronic Information Expo (CITE 2023 for short) opened in Shenzhen. With the theme of "Innovation Leading, Collaborative Development", this year's Electronic Expo has an exhibition area of 80,000 square meters. It has set up a CITE brand innovation theme pavilion, a new display and application pavilion, a new generation of information industry smart manufacturing pavilion, and a smart car technology pavilion. The 5 major pavilions, including the Basic Electronics Pavilion, focus on 7 major themes, including smart home, new display, high-end semiconductor, Xinchuang, big data and storage, basic components, and intelligent networked vehicles. More than 1,200 exhibitors participated in the exhibition, and many new Products, new technologies, new services, new models, new trends, and new concepts will be launched in a concentrated manner. In the forum activities in the morning, Mao Junfa, academician of the Chinese Academy of Sciences and president of Shenzhen University, analyzed the opportunities and challenges faced by China's information technology development. He summarized the opportunity into three points: China's information infrastructure is constantly improving. According to statistics, the total length of optical fibers laid in China exceeds the sum of the lengths of optical fibers in all other countries in the world. How terrifying is this? He said that regardless of whether the data is accurate or not, the country is very powerful in this regard. The commercial use of 5G will further expand the depth and breadth of information technology applications. The advent of the era of artificial intelligence has raised informatization to a new level. Of course there are opportunities as well as challenges. He summarized the challenge from four aspects: The core technology of informatization is controlled by people, lacking core and soul; Information security and public opinion control; The informatization infrastructure is generally good, but there is a large gap between urban and rural areas, and the gap between east and west. Even if the backward rural areas have money, they may not be willing to informatize. Once informatization, people will be laid off; How far does the existing scientific theory support the new technology? This is also a challenge. He pointed out that both Moore's Law and Shannon's Theorem are facing extreme challenges and require new theoretical breakthroughs. Reposted from: International Electronic Commerce, automatically translated by Google