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1. electronic
dry cabinet can effectively prevent wafer or grain
semi-finished products in the open state, wafters may get damp and mildew
caused by tube atmosphere furnace glass substrate stack.
2. N2
cabinet can prevent partial oxidation of fiber K gold joints,
Bonding gold wire materials, Lead frame copper and other metals.
3.? low
humidity cabinet can prevent “gold finger” spatter caused by
explosive exhaust of PCB substrate before SMT process.
4. wafer storage cabinet can
effectively prevent the internal oxidation short circuit of IC (including
QFP/BGA/CSP) integrated circuits and other components during storage, as well
as the phenomenon of internal micro-cracking, separation and delamination, and
“popcorn” outside during welding.
5.
chip storage dry cabinet is widely used in the field of electronic chip
manufacturing. The function of electronic moisture-proof box is to include IC,
chip, TFT-LCD glass substrate, energy-saving muffle furnace fiber K gold joint,
bonding gold wire, copper, PCB substrate, etc.
Pls
send an email to sales@dry-cabinet.cn or visit our website https://www.dry-cabinet.cn for more
details.
