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As
we all know, in the same area, the circular and square product area with the
same diameter or side length can be placed is different, and the general square
can be put more, in other words, the square has a higher utilization rate of
the effective space. So why wafer instead of crystal square? The square DIE, in
a circular WAFER always produces a certain amount of space waste, so in the
pursuit of the most profitable and efficient modern, such a configuration can continue
to use the reason, the circle can stand out in various shapes, It’s worth
thinking about.
First
of all, because of the production process of silicon wafer, the silicon wafer
is purified and then melted by single crystal direct drawing method and then
cut into pieces. The pull method used in the single crystal direct drawing
process is rotary pull. This pull method determines the cylindrical shape of
the ingot, thus determining that the wafer is round.
But
if you look closely, you will find that the wafer is not a standard circle, there
are flat grooves or V grooves, this step can help the subsequent process to
determine the location of the WAFER, but also marked the single crystal growth
metallography, convenient for the subsequent cutting and testing procedures.
And the basic cutting is in the edge position, is a certain sense of resource
reuse.
