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Integrated circuit chips such as IC, BGA, QFP are common
electronic products. These devices belong to MSD(moisture sensitive
components), a dry cabinet creates a low humidity environment for electronic
components.
Vacuum sealing is for moisture resistance, are the chips need to be sealed before putting into the cabinet? Actually, this is unnecessary. The prem
ise of the
vacuum packaging is that the chip needs to be
dried first and without moisture absorption. If the chips are effected with
damp, the vacuum may prevent the moisture from entering again.
The moisture inside the chip will lead to metal oxidation inside? The humidity on the surface of the device will further penetrate into the chip. On one hand, the low humidity dry cabinet can stop chips from getting damp, on the other hand, the moisture inside chips is slowly released into the low humidity dry cabinet.
If the user will open the door frequently, a fast
dehumidifying drying cabinet is suggested. And the chips don’t need to be
sealed in a low humidity dry cabinet.
In addition, EJER is the co
mmonly used low humidity storage
cabinet brand. We have many regular customers, such as Toshiba, Intel, NXP
semiconductors, Foxconn, Heraeus Materials Singapore Pte Ltd, Queensland
University of Technology, The University of Sydney.
For more information, you can visit our web-site: https://www.dry-cabinet.cn